Fabrikant :
Aries Electronics
Beskrivelse :
CONN IC DIP SOCKET 18POS TIN
Type :
DIP, 0.6" (15.24mm) Row Spacing
Antal positioner eller stifter (gitter) :
18 (2 x 9)
Pitch - Parring :
0.100" (2.54mm)
Kontakt Afslut - Parring :
Tin
Kontakt Afslut tykkelse - Parring :
200.0µin (5.08µm)
Kontaktmateriale - Parring :
Phosphor Bronze
Monteringstype :
Through Hole
Funktioner :
Closed Frame, Elevated
Pitch - Post :
0.100" (2.54mm)
Kontakt Afslut - Post :
Tin
Kontakt Afslut tykkelse - Post :
200.0µin (5.08µm)
Kontaktmateriale - Post :
Phosphor Bronze
Boligmateriale :
Polyamide (PA46), Nylon 4/6, Glass Filled
Driftstemperatur :
-55°C ~ 105°C