Fabrikant :
TE Connectivity AMP Connectors
Beskrivelse :
CONN IC DIP SOCKET 20POS GOLD
Type :
DIP, 0.3" (7.62mm) Row Spacing
Antal positioner eller stifter (gitter) :
20 (2 x 10)
Pitch - Parring :
0.100" (2.54mm)
Kontakt Afslut - Parring :
Gold
Kontakt Afslut tykkelse - Parring :
30.0µin (0.76µm)
Kontaktmateriale - Parring :
Beryllium Copper
Monteringstype :
Through Hole
Funktioner :
Closed Frame
Pitch - Post :
0.100" (2.54mm)
Kontakt Afslut - Post :
Gold
Kontakt Afslut tykkelse - Post :
30.0µin (0.76µm)
Kontaktmateriale - Post :
Beryllium Copper
Boligmateriale :
Thermoplastic, Glass Filled
Driftstemperatur :
-55°C ~ 125°C