Fabrikant :
Omron Electronics Inc-EMC Div
Beskrivelse :
CONN IC DIP SOCKET 8POS GOLD
Type :
DIP, 0.3" (7.62mm) Row Spacing
Antal positioner eller stifter (gitter) :
8 (2 x 4)
Pitch - Parring :
0.100" (2.54mm)
Kontakt Afslut - Parring :
Gold
Kontakt Afslut tykkelse - Parring :
10.0µin (0.25µm)
Kontaktmateriale - Parring :
Beryllium Copper
Monteringstype :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Kontakt Afslut - Post :
Gold
Kontakt Afslut tykkelse - Post :
10.0µin (0.25µm)
Kontaktmateriale - Post :
Beryllium Copper
Boligmateriale :
Polybutylene Terephthalate (PBT), Glass Filled
Driftstemperatur :
-55°C ~ 125°C