t-Global Technology - DC0011/08-TI900-0.12-2A

KEY Part #: K6153177

DC0011/08-TI900-0.12-2A Prissætning (USD) [239798stk Lager]

  • 1 pcs$0.15424
  • 10 pcs$0.14792
  • 25 pcs$0.14064
  • 50 pcs$0.13700
  • 100 pcs$0.13510
  • 250 pcs$0.12586
  • 500 pcs$0.11846
  • 1,000 pcs$0.10735
  • 5,000 pcs$0.10365

Varenummer:
DC0011/08-TI900-0.12-2A
Fabrikant:
t-Global Technology
Detaljeret beskrivelse:
THERM PAD 19.05MMX12.7MM W/ADH.
Producentens standard ledetid:
På lager
Opbevaringstid:
Et år
Chip fra:
Hong Kong
RoHS:
Betalingsmetode:
Forsendelsesmåde:
Familiekategorier:
KEY Components Co., LTD er en distributør af elektroniske komponenter, der tilbyder produktkategorier inklusive: Termiske - Pads, Sheets, Termoelektriske, Peltier-moduler, Termiske - Termoelektriske, Peltier Assemblies, Termiske - Varmepumper, Dampkamre, Fans - Tilbehør, Termisk - Væskekøling, Fans - Fingervagter, Filtre & amp; and Termisk - Tilbehør ...
Konkurrencefordel:
Vi er specialiserede i t-Global Technology DC0011/08-TI900-0.12-2A elektroniske komponenter. DC0011/08-TI900-0.12-2A kan sendes inden for 24 timer efter bestilling. Hvis du har krav til DC0011/08-TI900-0.12-2A, bedes du indsende en anmodning om tilbud her eller send os en e-mail: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DC0011/08-TI900-0.12-2A Produktegenskaber

Varenummer : DC0011/08-TI900-0.12-2A
Fabrikant : t-Global Technology
Beskrivelse : THERM PAD 19.05MMX12.7MM W/ADH
Serie : Ti900
Del Status : Active
Anvendelse : TO-220
Type : Die-Cut Pad, Sheet
Form : Rectangular
Omrids : 19.05mm x 12.70mm
Tykkelse : 0.0050" (0.127mm)
Materiale : Silicone
Lim : Adhesive - Both Sides
Backing, Carrier : Viscose
Farve : White
Termisk modstandsdygtighed : -
Varmeledningsevne : 1.8 W/m-K

Du kan også være interesseret i
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft