Bergquist - HF115AC-0.0055-AC-54

KEY Part #: K6153702

HF115AC-0.0055-AC-54 Prissætning (USD) [935213stk Lager]

  • 1 pcs$0.03955
  • 10 pcs$0.03441
  • 50 pcs$0.03085
  • 100 pcs$0.02729
  • 500 pcs$0.02373
  • 1,000 pcs$0.01780
  • 5,000 pcs$0.01542

Varenummer:
HF115AC-0.0055-AC-54
Fabrikant:
Bergquist
Detaljeret beskrivelse:
THERM PAD 19.05MMX12.7MM W/ADH.
Producentens standard ledetid:
På lager
Opbevaringstid:
Et år
Chip fra:
Hong Kong
RoHS:
Betalingsmetode:
Forsendelsesmåde:
Familiekategorier:
KEY Components Co., LTD er en distributør af elektroniske komponenter, der tilbyder produktkategorier inklusive: DC-fans, Termiske - Varmepumper, Dampkamre, Termiske - Pads, Sheets, Termisk - Væskekøling, Termiske - Lim, Epoxier, Fedtstoffer, Pastiner, Termoelektriske, Peltier-moduler, Fans - Fingervagter, Filtre & amp; and Termiske - Termoelektriske, Peltier Assemblies ...
Konkurrencefordel:
Vi er specialiserede i Bergquist HF115AC-0.0055-AC-54 elektroniske komponenter. HF115AC-0.0055-AC-54 kan sendes inden for 24 timer efter bestilling. Hvis du har krav til HF115AC-0.0055-AC-54, bedes du indsende en anmodning om tilbud her eller send os en e-mail: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HF115AC-0.0055-AC-54 Produktegenskaber

Varenummer : HF115AC-0.0055-AC-54
Fabrikant : Bergquist
Beskrivelse : THERM PAD 19.05MMX12.7MM W/ADH
Serie : Hi-Flow® 115-AC
Del Status : Active
Anvendelse : TO-220
Type : Pad, Sheet
Form : Rectangular
Omrids : 19.05mm x 12.70mm
Tykkelse : 0.0055" (0.140mm)
Materiale : Phase Change Compound
Lim : Adhesive - One Side
Backing, Carrier : Fiberglass
Farve : Gray
Termisk modstandsdygtighed : 0.35°C/W
Varmeledningsevne : 0.8 W/m-K

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