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- Varenummer:
- APF19-19-13CB
- Fabrikant:
- CTS Thermal Management Products
- Detaljeret beskrivelse:
- HEATSINK LOW-PROFILE FORGED.
- Producentens standard ledetid:
- På lager
- Opbevaringstid:
- Et år
- Chip fra:
- Hong Kong
- RoHS:
- Betalingsmetode:
-
- Forsendelsesmåde:
- Familiekategorier:
- KEY Components Co., LTD er en distributør af elektroniske komponenter, der tilbyder produktkategorier inklusive: Termoelektriske, Peltier-moduler, Termiske - Varmepumper, Dampkamre, Ventilatorer - Tilbehør - Ventilatorledninger, Fans - Tilbehør, AC fans, Termiske - Termoelektriske, Peltier Assemblies, DC-fans and Fans - Fingervagter, Filtre & amp; ...
- Konkurrencefordel:
- Vi er specialiserede i CTS Thermal Management Products APF19-19-13CB elektroniske komponenter. APF19-19-13CB kan sendes inden for 24 timer efter bestilling. Hvis du har krav til APF19-19-13CB, bedes du indsende en anmodning om tilbud her eller send os en e-mail: rfq@key-components.com
APF19-19-13CB Produktegenskaber
Varenummer :
APF19-19-13CB
Fabrikant :
CTS Thermal Management Products
Beskrivelse :
HEATSINK LOW-PROFILE FORGED
Serie :
APF
Del Status :
Active
Type :
Top Mount
Pakke afkølet :
Assorted (BGA, LGA, CPU, ASIC...)
Vedhæftningsmetode :
Thermal Tape, Adhesive (Not Included)
Form :
Square, Fins
Længde :
0.748" (19.00mm)
Bredde :
0.748" (19.00mm)
Diameter :
-
Højde Off Base (Højde af Fin) :
0.500" (12.70mm)
Effektdissipation @ Temperaturstigning :
-
Termisk modstand @ Forceret luftstrøm :
4.00°C/W @ 200 LFM
Termisk modstand @ Naturligt :
-
Materiale :
Aluminum
Materiale finish :
Black Anodized
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