Fabrikant :
Chip Quik Inc.
Beskrivelse :
THERMALLY STABLE SOLDER PASTE NO
Sammensætning :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Smeltepunkt :
281°F (138°C)
Form :
Jar, 1.76 oz (50g)
Opbevaringstid Start :
Date of Manufacture
Opbevaring / Køling Temperatur :
68°F ~ 77°F (20°C ~ 25°C)