t-Global Technology - PC93-10-10-1

KEY Part #: K6153179

PC93-10-10-1 Prissætning (USD) [389672stk Lager]

  • 1 pcs$0.09492
  • 10 pcs$0.09057
  • 25 pcs$0.08590
  • 50 pcs$0.08369
  • 100 pcs$0.08258
  • 250 pcs$0.07692
  • 500 pcs$0.07239
  • 1,000 pcs$0.06561
  • 5,000 pcs$0.06334

Varenummer:
PC93-10-10-1
Fabrikant:
t-Global Technology
Detaljeret beskrivelse:
THERM PAD 10MMX10MM GRAY.
Producentens standard ledetid:
På lager
Opbevaringstid:
Et år
Chip fra:
Hong Kong
RoHS:
Betalingsmetode:
Forsendelsesmåde:
Familiekategorier:
KEY Components Co., LTD er en distributør af elektroniske komponenter, der tilbyder produktkategorier inklusive: Termoelektriske, Peltier-moduler, DC-fans, Termiske - Pads, Sheets, Fans - Tilbehør, Termiske - Termoelektriske, Peltier Assemblies, Ventilatorer - Tilbehør - Ventilatorledninger, Termiske - Varmepumper, Dampkamre and Fans - Fingervagter, Filtre & amp; ...
Konkurrencefordel:
Vi er specialiserede i t-Global Technology PC93-10-10-1 elektroniske komponenter. PC93-10-10-1 kan sendes inden for 24 timer efter bestilling. Hvis du har krav til PC93-10-10-1, bedes du indsende en anmodning om tilbud her eller send os en e-mail: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

PC93-10-10-1 Produktegenskaber

Varenummer : PC93-10-10-1
Fabrikant : t-Global Technology
Beskrivelse : THERM PAD 10MMX10MM GRAY
Serie : PC93
Del Status : Active
Anvendelse : -
Type : Conductive Pad, Sheet
Form : Square
Omrids : 10.00mm x 10.00mm
Tykkelse : 0.0400" (1.016mm)
Materiale : Non-Silicone
Lim : -
Backing, Carrier : -
Farve : Gray
Termisk modstandsdygtighed : -
Varmeledningsevne : 2.0 W/m-K

Du kan også være interesseret i
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft