Laird Technologies - Thermal Materials - A14565-01

KEY Part #: K6153199

A14565-01 Prissætning (USD) [1003stk Lager]

  • 1 pcs$46.53826
  • 4 pcs$46.30672

Varenummer:
A14565-01
Fabrikant:
Laird Technologies - Thermal Materials
Detaljeret beskrivelse:
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5110 9x9" 2.8W/mK gap filler
Producentens standard ledetid:
På lager
Opbevaringstid:
Et år
Chip fra:
Hong Kong
RoHS:
Betalingsmetode:
Forsendelsesmåde:
Familiekategorier:
KEY Components Co., LTD er en distributør af elektroniske komponenter, der tilbyder produktkategorier inklusive: Termiske - Varmepumper, Dampkamre, Termiske - Termoelektriske, Peltier Assemblies, Fans - Tilbehør, Termoelektriske, Peltier-moduler, Termisk - Varmepumper, AC fans, Termiske - Lim, Epoxier, Fedtstoffer, Pastiner and Termisk - Tilbehør ...
Konkurrencefordel:
Vi er specialiserede i Laird Technologies - Thermal Materials A14565-01 elektroniske komponenter. A14565-01 kan sendes inden for 24 timer efter bestilling. Hvis du har krav til A14565-01, bedes du indsende en anmodning om tilbud her eller send os en e-mail: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A14565-01 Produktegenskaber

Varenummer : A14565-01
Fabrikant : Laird Technologies - Thermal Materials
Beskrivelse : THERM PAD 228.6MMX228.6MM BLUE
Serie : Tflex™ 500
Del Status : Not For New Designs
Anvendelse : -
Type : Gap Filler Pad, Sheet
Form : Square
Omrids : 228.60mm x 228.60mm
Tykkelse : 0.110" (2.79mm)
Materiale : Silicone Elastomer
Lim : Tacky - Both Sides
Backing, Carrier : -
Farve : Blue
Termisk modstandsdygtighed : -
Varmeledningsevne : 2.8 W/m-K

Du kan også være interesseret i
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft

  • 175-6-240P

    Wakefield-Vette

    THERM PAD 19.1MMX12.7MM GRAY. Thermal Interface Products THERMAL INTERFACE PROD TO-220